BE Semiconductor: With A Little Delay, The Hybrid Bonding Train Is About To Leave


Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process.

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Investment thesis

BE Semiconductor Industries N.V. (OTC:BESIY) is a company that has a prominent place in my portfolio. November the 9th was the last time a wrote about the company and a lot has happened since then, BESIY has shot up



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